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[TMF Implementation Case] Microelectronics Factory (Shenzhen, China)

Verification that the introduction of the TMF system is a suitable choice! Industrial wastewater treatment and recycling system.

Dicing and back grinding are processes for cutting and thinning silica wafers in semiconductor device manufacturing. After these processes, the wafers are washed with ultra-pure water (UPW) to remove fine silica particles and other impurities. This wastewater contains fine silica particles from the ultra-pure water, and it may also be mixed with grinding fluid. When discharging this industrial wastewater in accordance with legal standards or performing further clarification treatment for wastewater reuse, the removal of those impurities that are highly concentrated in the wastewater is essential. In this semiconductor manufacturing site, we will verify that the introduction of the TMF system is a suitable choice. [Installation Site] ■ Microelectronics factory in Shenzhen, China *For more details, please refer to the PDF document or feel free to contact us.

• Company：アクアテクノロジー 環境事業部
• Price：Other

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